SRM AP Signs MOU with Forum Engineering Inc. and Cognavi India Private Limited – 2024

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  • May 2, 2025
  • 1 min read
SRM AP Signs MOU with Forum Engineering Inc. and Cognavi India Private Limited – 2024

In a landmark move towards enhancing global educational opportunities, SRM University-AP has entered into a Memorandum of Understanding (MOU) with Japan’s Forum Engineering Inc. and Cognavi India Private Limited. The agreement aims to foster collaboration in providing students with career opportunities in Japan’s thriving engineering sector.
The signing ceremony, which took place at the SRM University-AP campus, brought together key representatives from all three parties. The MOU outlines a comprehensive operational framework, detailing the roles and expectations of each participant, and sets a clear roadmap for successful partnership.